The polymeric materials market revenue will double over the next five years, says Yole Développement, driven by miniaturisation and higher functionalities in applications like AI, 5G, and AR/VR requiring packaging including high-density FOWLP, 3D stacked TSV, WLCSP and flip-chip. “The innovative advanced packaging platforms have reached a new level of complexity and now demand higher ...
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from Electronics Weekly https://www.electronicsweekly.com/news/business/polymeric-materials-2018-12/
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