What would the chip industry give for a process which promises six generations of scaling? What wouldn’t it give? One of the many intriguing components of the USA’s Electronics Resurgence Initiative sponsored by DARPA is an old eight inch Cypress fab now being used to mix CNTs and RRAM cells using a 3D stacked CMOS ...
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from Electronics Weekly https://www.electronicsweekly.com/blogs/mannerisms/manufacturing-mannerisms/manna-from-heaven-2018-12/
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