Intel has cone up with a packaging technology called ‘Foveros’. Foveros ‘paves the way for devices and systems combining high-performance, high-density and low-power silicon process technologies,’ says Intel, ‘Foveros is expected to extend die stacking beyond traditional passive interposers and stacked memory to high-performance logic, such as CPU, graphics and AI processors.’ Intel adds that ...
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from Electronics Weekly https://www.electronicsweekly.com/news/business/intel-debuts-foveros-2018-12/
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