Infineon is claiming a first, with an industrial-grade embedded SIM (eSIM) in a 2.5 x 2.7mm wafer-level chip-scale package (WLCSP). It is aimed at machine-to-machine comms and IoT applications, for example vending machines, remote sensors and asset trackers. “Providing robust quality on a miniature footprint that works even under harshest conditions remains a challenge for silicon ...
This story continues at Industrial grade cellular comms SIM is 2.5 x 2.7mm for IoT and M2M
Or just read more coverage at Electronics Weekly
from Electronics Weekly https://www.electronicsweekly.com/news/products/digital-integrated-circuits/industrial-grade-cellular-comms-sim-2-5-x-2-7mm-iot-m2m-2018-12/
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