Smiths Interconnect offers wafer-level chip test probes

Smiths Interconnect has introduced a range of probe heads for wafer-level chip-scale package testing. The probe heads in the Volta series are used for testing the chips while in their wafer form. In the design spring probe contacts are used in place of cantilever and traditional vertical probe card technologies. The am is to create ...

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from Electronics Weekly https://www.electronicsweekly.com/news/smiths-interconnect-offers-wafer-level-chip-test-probes-2017-12/