LETI integrates III-V lasers on 200mm wafers using CMOS flow

  Leti has integrated hybrid III-V silicon lasers on 200mm wafers using standard CMOS process flow. This shows the way to transitioning away from 100mm wafers and a process based on bulk III-V technology that requires contacts with noble metals and lift-off based patterning. The project, carried out in the framework of the IRT Nanoelec ...

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from Electronics Weekly https://www.electronicsweekly.com/news/business/leti-integrates-iii-v-2017-12/