French research group Leti has demonstrated a III-V semiconductor fabrication technique which it says will simplify the production of lasers. Leti says it has integrated hybrid III-V silicon lasers on 200mm wafers using standard CMOS process flow. “This shows the way to transitioning away from 100mm wafers and a process based on bulk III-V technology ...
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from Electronics Weekly https://www.electronicsweekly.com/news/cmos-will-cut-cost-integrated-photonics-says-leti-2017-12/
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