Back in 1950, the US National Bureau of Standards initiated a Navy project called Tinkertoy aimed at producing smaller, automatically-assembled electronic systems. Silk screen printing techniques were used to form passive components on ceramic wafers 22 mm square and 1.5mm thick. The printed circuits on the wafers connected the components to riser wires leading to ...
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from Electronics Weekly http://www.electronicsweekly.com/blogs/mannerisms/yarns/489397-2017-01/
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