IFS 2017 in London this week looked at current technology issues on 450mm, EUV, scaling, 3D NAND and FD-SOI “It looks like 300mm is the end of the process road,” said Malcolm Penn, CEO of Future Horizons, adding, “then again, in this industry never say never.” The 450mm champion – Intel – has stalled ...
Read full article: 450mm, EUV, Scaling, 3D NAND and FD-SOI
from Electronics Weekly http://www.electronicsweekly.com/blogs/mannerisms/manufacturing-mannerisms/450mm-euv-scaling-3d-nand-fd-soi-2017-01/
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