Imec and EVG have demonstrated 1.8µm pitch overlay accuracy for wafer-to-wafer bonding. Wafer-to-wafer bonding is a promising technique for enabling high-density integration of future ICs through 3D integration. This is achieved by aligning top and bottom wafers that are then bonded, thus creating a stacked IC. An important advantage is that wafers/ICs with different technologies ...
Read full article: Imec, EVG demo superior overlay accuracy for wafer-to-wafer bonding
from Electronics Weekly http://www.electronicsweekly.com/news/business/imec-evg-demo-superior-overlay-accuracy-wafer-wafer-bonding-2017-01/
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