Flex Logix, the embedded FPGA IP specialist has signed a deal with DARPA which allows aby company or government abency designing ICs for the US government to use Flex Logix’ EFLX arrays. Flex Logix will make available EFLX arrays in the TSMC 16FFC process node from 2.5K to 122.5K LUTs so that these companies and ...
Read full article: Flex Logix signs eFPGA deal with DARPA
from Electronics Weekly http://www.electronicsweekly.com/news/business/492810-2017-01/
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