Congatec has introduced a low profile industrial-grade motherboard family featuring the new 7th Gen Intel Core U (Kaby Lake) processors. The boards incorporate a SIM card socket for 3G/4G or narrow band wireless. The conga-IC175 Thin Mini-ITX motherboards ship with 4 different dual-core variants of 7th Gen Intel Core U SoC processors and have a ...
Read full article: Low profile Intel Core U industrial card
from Electronics Weekly http://www.electronicsweekly.com/news/products/bus-systems-sbcs/low-profile-intel-core-u-industrial-card-2017-03/
No comments:
Post a Comment