Micron is sampling a 32-layer 32GB 3D NAND chip with a 60.217mm2 die size for mobile applications. It first into a 9 x 9mm PoP package or 8.5 x 11mm MCP. The chip conforms to the Universal Flash Storage (UFS) 2.1 standard which delivers, says Micron, “up to 33% higher bandwidth versus the e.MMC 5.1 ...
Read full article: Micron samples mobile 3D NAND memory
from Electronics Weekly http://www.electronicsweekly.com/news/business/micron-samples-mobile-3d-nand-memory-2016-08/
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