The Fan-Out packaging market will grow at 19,4% CAGR 2019-24 to reach $3.8 billion in 2024, forecats Yole Developpment. In 2015, the Fan-Out market was small and consisted mostly of standard devices like BB , RF , and PMU . But after TSMC’s 2016 game-changer with inFO for Apple’s iPhone APE, market value increased 3.5x ...
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from Electronics Weekly https://www.electronicsweekly.com/news/business/fan-packaging-growing-19-4-2019-02/
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