Siltectra of Dresden will begin offering “outsourced wafering” services to customers, starting in January 2019. The new business aims to provide affordable access to the company’s COLD SPLIT wafering solution to semiconductor manufacturers and materials providers, and help speed the adoption of new substrate materials by the industry at large. The manufacturing initiative will be ...
This story continues at Siltectra to offer wafering services.
Or just read more coverage at Electronics Weekly
from Electronics Weekly https://www.electronicsweekly.com/news/business/siltectra-offer-wafering-services-2018-10/
No comments:
Post a Comment