Israeli 3D printing firm Nano Dimension has developed copper nano-particles that are resistant to oxidation and fuse into a conductive line after sintering at <160°C. “The main challenge in developing nano-copper ink is oxidation of the particles, including oxidation during sintering,” said the firm. “Typically, sintering of copper nano-particles requires significant energy in an oxygen-free ...
Read full article: Printable copper resists oxidation
from Electronics Weekly https://www.electronicsweekly.com/news/business/manufacturing/printable-copper-resists-oxidation-2017-06/
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