Israeli 3D printing firm Nano Dimension has developed novel copper nanoparticles that are resistant to oxidation, and fuse into conductive lines after sintering at <160°C. “The main challenge in developing nano-copper ink is oxidation of the particles, including during sintering into a continuous conductive trace,” said the firm. “Typically, sintering of copper nanoparticles requires high ...
Read full article: Copper nano-particles resistant oxidation for 3D printing
from Electronics Weekly https://www.electronicsweekly.com/news/business/manufacturing/copper-nano-particles-resistant-oxidation-3d-printing-2017-06/
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