Tsinghua Unigroup, the acquisitive Chinese investment fund, is still trying to do a memory technology exchange deal with Micron, reports the Commercial Times. Tsinghua is said to be tied in with Wuhan Xinxin Semiconductor Manufacturing Corporation (XMC) to develop memories including 3D NAND. The deal being pursued is a technology licence plus foundry arrangement under ...
Tsinghua goes back to Micron for 3D NAND technology
from ElectronicsWeekly http://www.electronicsweekly.com/news/business/tsinghua-goes-back-to-micron-for-3d-nand-technology-2016-07/
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