More on: Leti 3D on-chip network uses active interposer

French semiconductor research lab has developed a 3D network-on-chip (3D-NoC) for fast computing. It is intended to be used to transfer data between stacked die, or across an array of die on a silicon interposer. “The steady rise in the number of applications that require high-performance computing creates a demand for new hardware-plus-software communications solutions ...

More on: Leti 3D on-chip network uses active interposer

from ElectronicsWeekly http://www.electronicsweekly.com/news/design/communications/more-on-leti-3d-on-chip-network-uses-active-interposer-2016-07/