Engineers at Oregon State University have tripled heat transfer (in W/m2K) in heatsinks that rely in liquid boiling, by finding a way to induce and control boiling bubble formation. “One of the key limitations for electronic devices is the heat they generate, and something that helps dissipate that heat will help them operate at faster ...
Heat pipes improved by high-tech dots
from ElectronicsWeekly http://www.electronicsweekly.com/news/research-news/heat-pipes-improved-by-high-tech-dots-2016-05/
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