Tuesday, 17 May 2016

ST puts SiC auto ICs on six inch wafers

ST has launched a set of SiC power devices aimed at accelerating automotive electrification. A complete set of devices allows full conversion of auto power modules to SiC for greater vehicle range, convenience, and reliability ST is moving its SiC production to 6-inch wafers and has an AEC-Q101 qualification program to complete in early 2017, ...

ST puts SiC auto ICs on six inch wafers



from ElectronicsWeekly http://www.electronicsweekly.com/news/business/st-moves-sic-auto-ics-to-6inch-wafers-2016-05/

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