A 3D chip technology, which stacks active layers of transistors without the need for through-silicon vias (TSVs) has been developed by Leti and is the focus of a collaboration with Qualcomm. Dubbed CoolCube, the French research centre has developed a device scale-stacking technology for complex system-on-chips such as mobile processors which is why Qualcomm is ...
Leti 3D chip technology gets big push from Qualcomm
from ElectronicsWeekly http://www.electronicsweekly.com/news/leti-3d-chip-technology-gets-big-push-from-qualcomm-2016-04/
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