Friday, 15 April 2016

ARM and UMC tie up for physical IP

ARM and UMC are to develop multiple physical IP platforms, enabling UMC customers to easily implement ARM®P Artisan physical IP into SoC designs and reduce time-to-market. The agreement spans applications in automotive, Internet of Things (IoT) and mobile, from a 55ULP platform for IoT applications to a 14nm FinFET test chip for leading-edge mobile applications. ...

ARM and UMC tie up for physical IP



from ElectronicsWeekly http://www.electronicsweekly.com/news/business/arm-and-umc-tie-up-for-physical-ip-2016-04/

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