In H2 Hynix intends to begin volume production of a 72-layer 256Gb TLC 3D NAND flash memory – the densest 3D NAND on the market ahead of the 48-layer devices of Toshiba, Samsung and Intel/Micron. Hynix launched 36-layer 128Gb 3D NAND chips in April 2016, started production of 48-layer 256Gb 3D NAND chips last November ...
Read full article: Hynix launches 72-layer 3D NAND
from Electronics Weekly https://www.electronicsweekly.com/news/business/hynix-launches-72-layer-nand-2017-04/
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