Fraunhofer IMS has developed a way to build pressure sensors on top of finished CMOS wafers, saving chip area over the alternative side-by-side approach, claimed the institute. “Due to the specially developed sensor process steps, which run at temperatures below 400°C, the circuit and sensor production can be decoupled from each other,” said the Fraunhofer, ...
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from Electronics Weekly https://www.electronicsweekly.com/news/design/pressure-sensor-built-finished-cmos-2018-04/
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