A new method of creating bendable silicon chips could help pave the way for a new generation of high-performance flexible electronic devices, say Glasgow University researchers. The researchers have described how they scaled up the established processes for making flexible silicon chips to the size required for delivering high-performance bendable systems in the future, and ...
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from Electronics Weekly https://www.electronicsweekly.com/uncategorised/glasgow-uni-makes-bendy-chips-2018-03/
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