Globalfoundries has demonstrated silicon functionality of a 2.5D package for its high-performance 14nm FinFET FX-14 integrated design system for ASICs. The 2.5D ASIC package has a stitched interposer capability to overcome lithography limitations and a two terabits per second (2Tbps) multi-lane HBM2 PHY, developed in partnership with Rambus. B It will also be used for GloFo’s 7nm Finfet process. ...
This story continues at Globalfoundries demo-es 2.5D package for 14nm and 7nm finfet processes.
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from Electronics Weekly https://www.electronicsweekly.com/news/business/506147-2017-08/
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