Goepel Electronic will use next month’s Electronica exhibition in Munich to present a 2D/3D camera module for optically inspecting PCBs and ball grid-array chip packages. 3-D imaging is now making its impact on automated optical inspection (AOI) and the key feature, says Goepel, is providing shadow-free 3D measurement. What it has done with the 3D·ViewZ module is ...
Read full article: 3-D imaging makes an impact on PCB optical inspection
from Electronics Weekly http://www.electronicsweekly.com/news/3-d-imaging-makes-impact-pcb-optical-inspection-2016-10/
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