In two late-news papers at IEDM 2016 in SanFrancisco on December 3rd to 7th, both TSMC and the IBM, Globalfoundries, Samsung alliance will take the wraps off their forthcoming 7nm FinFET technology platforms. A 7nm CMOS Platform Technology for Mobility from TSMC will present the world’s first 7nm CMOS platform technology for mobile system-on-a-chip (SoC) ...
Read full article: 7nm processes at IEDM
from Electronics Weekly http://www.electronicsweekly.com/news/business/7nm-processes-iedm-2016-10/
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