Concurrent Technologies has designed its latest COM processor module around a low power variant of the 6th generation Intel Core processor, previously known as Skylake-H. The company has designed the XMC module with a conduction-cooled envelope suitable for use on both custom and open standard based carriers, including VPX and VME. Designated, XP B5x/msd the ...
Intel Core i3 processor scales for COM embedded modules
from ElectronicsWeekly http://www.electronicsweekly.com/news/intel-core-i3-processor-scales-for-com-embedded-modules-2016-05/
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