Wednesday, 9 January 2019

CES: Toshiba shows 96 layer QLC flash chip

Toshiba showed a  96-layer BiCS Flash chip with 4-bit-per-cell quadruple-level cell (QLC) technology. A single chip delivers  1.33 Tb (Terabits) while a single package with 16-dies stacked can deliver  2.66 TB (Terabytes). Toshiba is sampling its 1 TB NVMe single package BG4 series SSDs to PC OEM customers in limited quantities.

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from Electronics Weekly https://www.electronicsweekly.com/news/business/ces-toshiba-shows-96-layer-qlc-flash-chip-2019-01/

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