Imec and wafer-probe specialist Cascade Microtech have developed an automatic system for pre-bond testing of advanced 3D chips. Pre-bond testing is important to increase the yield of 3D stacked chips. The new system enables probing and hence testing of chips with large arrays of 40µm-pitch micro-bumps, on 300mm wafers. As an emerging technology, 3D ...
Read full article: Imec develops pre-bond tester for 3D chips
from Electronics Weekly https://www.electronicsweekly.com/news/business/imec-develops-pre-bond-tester-3d-chips-2017-05/
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