Kyocera and Vicor will develop power-on-package (PoP) technology for high-performance and artificial intelligence (AI) processors. Kyocera will integrate processor power and data delivery with organic packages, module substrates and motherboard designs – using its design technology, simulation tools and manufacturing experience to route I/O, high-speed memory and high-current power. Vicor will provide current multipliers ready ...
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from Electronics Weekly https://www.electronicsweekly.com/news/business/manufacturing/kyocera-vicor-create-power-package-ai-processors-2019-04/
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