Panasonic has launched a delamination-free semiconductor encapsulation material for semiconductor packages use in automotive and industrial applications. Full-scale production started in January 2019. Panasonic claims it will increase the reliability of automotive ECUs and industrial equipment. Previous semiconductor encapsulation materials, particularly those used in high-temperature environments, are prone to failures caused by interfacial adhesion loss between ...
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from Electronics Weekly https://www.electronicsweekly.com/news/business/panasonic-launches-delamination-free-ic-encapsulation-material-2019-02/
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