French research lab Leti has teamed up with low-volume chip firm CMP to provide 200mm multi-project wafers (MPWs) including non-volatile memory OxRAM. “Leti’s integrated silicon memory platform is developed for backend memories and non-volatility associated with embedded designs,” said the lab. “The technology platform will be based on titanium-doped hafnium oxide [HfO2/Ti] active layers.” The ...
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from Electronics Weekly https://www.electronicsweekly.com/news/design/eda-and-ip/non-volatile-oxram-multi-project-wafers-2018-08/
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