Imec and Soitec have demo-ed a sequential 3D front-end integration process by stacking two device layers on one another on a 300mm wafer. This vertical integration of sequentially processed device layers, also named sequential-3D integration (S3D), is perceived as a promising alternative to continue the benefits offered by semiconductor scaling, overcoming the constraints of geometrical ...
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from Electronics Weekly https://www.electronicsweekly.com/news/business/532325-2018-07/
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