Infineon is expanding its CoM (Coil on Module) portfolio for secure contactless ID documents. The new SLC52 security chip is now available, integrated with the card antenna into a polycarbonate monoblock inlay. Conventional chip packages are welded, soldered or glued to the card antenna. With the CoM package, however, the chip module communicates with the ...
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from Electronics Weekly https://www.electronicsweekly.com/news/business/515031-2017-11/
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