Chomerics Europe has introduced its TC50 high performance thermal compound for conducting heat between hot electronic components and heatsinks or enclosures. It is intended to provide low thermal impedance at multiple gaps to permit the deployment of commonly used spreaders. It only requires low compressive force to deform under assembly pressure. This is intended to ...
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from Electronics Weekly https://www.electronicsweekly.com/news/chomerics-makes-thermal-compound-ecus-processors-2017-09/
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