Monday, 3 July 2017

Hynix ramping 72-layer 3D NAND

Hynix has started to ramp volume production of its 72-layer 3D NAND memory, according to the Korea IT Times. The 256Gbit TLC chips chips are being used to deliver a 1Tbit SSD which uses Hynix’ own controller chip.. The chips are currently being made in Hynix’ Cheongju fab but it plans to add production from ...

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from Electronics Weekly https://www.electronicsweekly.com/news/business/hynix-ramping-72-layer-3d-nand-2017-07/

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