Wednesday, 10 May 2017

X-Fab makes GaN-on-Silicon devices on 200mm wafers

X-Fab has made its first GaN-on-Silicon devices made on 200mm wafers. The wafers used substrates fabricated at Exagan’s 200-mm epi-manufacturing facility in Grenoble, France. Exagan was founded in 2014 by CEA-Leti and Soitec to pursue GaN technology. X-Fab and Exagan have been working on the GaN-on-Silicon project since 2015. These epi wafers meet the physical ...

Read full article: X-Fab makes GaN-on-Silicon devices on 200mm wafers



from Electronics Weekly https://www.electronicsweekly.com/news/business/x-fab-makes-gan-silicon-devices-200mm-wafers-2017-05/

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