In July, Infineon intends to sample a new package technology called TRENCHSTOP Advanced Isolation. It will be used for TRENCHSTOP Highspeed 3 IGBTs for best-in-class thermal performance and simpler manufacturing. The initial product portfolio will feature IGBTs from 40 A to 90 A in 600 V. The package aims to replace both fully insulated packages ...
Read full article: Infineon to sample TRENCHSTOP packages in July
from Electronics Weekly https://www.electronicsweekly.com/news/business/infineon-sample-trenchstop-packages-july-2017-05/
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