Tuesday, 2 May 2017

FTDI Chip launches USB 3.1 evaluation modules

To complement its FT602 USB 3.1 (Gen 1) video class FIFO IC, which has now gone into full scale production, FTDI Chip has introduced a pair of accompanying hardware modules. The UMFT602A and UMFT602X units enable bridging of a FIFO bus to a USB3.0/1 host and are equipped with either HSMC or FMC (LPC) connectors. ...

Read full article: FTDI Chip launches USB 3.1 evaluation modules



from Electronics Weekly https://www.electronicsweekly.com/news/business/ftdi-chip-launches-usb-3-1-evaluation-modules-2017-05/

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