Tuesday, 13 November 2018

Electronica: Toshiba offers 130nm asic process for industrial applications

Toshiba has shipped its first 130nm ‘structured array’ asic, and announced this at Electronica today. Structured asics have a fixed array of logic in the underlying silicon, on to which custom metallisation is applied for each different application. Toshiba brands this ‘FFSA‘ for ‘fit fast structured array’, and said: “The FFSA 130nm process is added ...

This story continues at Electronica: Toshiba offers 130nm asic process for industrial applications

Or just read more coverage at Electronics Weekly



from Electronics Weekly https://www.electronicsweekly.com/news/products/fpga-news/electronica-toshiba-offers-130nm-asic-process-industrial-applications-2018-11/

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