A four year German industry and academia project has payed off, producing a new way to surface-mount very small led die and a technology demonstrator – a high intensity full-colour video wall module with emitters on a 1mm pitch. Running between December 2014 and February 2018, InteGreat was the project, with participants investigated existing manufacturing approaches ...
This story continues at German led wafer-level packaging project pays off for Osram
Or just read more coverage at Electronics Weekly
from Electronics Weekly https://www.electronicsweekly.com/blogs/led-luminaries/german-led-wafer-level-packaging-project-pays-off-osram-2018-07/
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